Coverart for item
The Resource Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method, by Seonho Seok, (electronic book)

Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method, by Seonho Seok, (electronic book)

Label
Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method
Title
Advanced packaging and manufacturing technology based on adhesion engineering
Title remainder
wafer-level transfer packaging and fabrication techniques using interface energy control method
Statement of responsibility
by Seonho Seok
Creator
Author
Subject
Language
eng
Summary
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology
Member of
Cataloging source
AZU
http://library.link/vocab/creatorName
Seok, Seonho
Dewey number
621.381/046
Index
no index present
LC call number
TJ241
LC item number
.S46 2018eb
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Series statement
Springer Series in Advanced Manufacturing,
http://library.link/vocab/subjectName
  • Engineering
  • Nanotechnology
  • Manufacturing industries
  • Machinery
  • Tools
  • Tribology
  • Corrosion and anti-corrosives
  • Coatings
  • Materials science
Label
Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method, by Seonho Seok, (electronic book)
Instantiates
Publication
Antecedent source
mixed
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.
Dimensions
unknown
Extent
1 online resource (viii, 115 pages, 106 illustrations)
File format
multiple file formats
Form of item
online
Isbn
9783319778716
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-3-319-77872-3
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
  • on1034546870
  • (OCoLC)1034546870
Label
Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method, by Seonho Seok, (electronic book)
Publication
Antecedent source
mixed
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
not applicable
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.
Dimensions
unknown
Extent
1 online resource (viii, 115 pages, 106 illustrations)
File format
multiple file formats
Form of item
online
Isbn
9783319778716
Level of compression
uncompressed
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other control number
10.1007/978-3-319-77872-3
Other physical details
online resource.
Quality assurance targets
absent
Reformatting quality
access
Specific material designation
remote
System control number
  • on1034546870
  • (OCoLC)1034546870

Library Locations

Processing Feedback ...