Coverart for item
The Resource Carbon nanotube based VLSI interconnects : analysis and design, Brajesh Kumar Kaushik, Manoj Kumar Majumder, (electronic book)

Carbon nanotube based VLSI interconnects : analysis and design, Brajesh Kumar Kaushik, Manoj Kumar Majumder, (electronic book)

Label
Carbon nanotube based VLSI interconnects : analysis and design
Title
Carbon nanotube based VLSI interconnects
Title remainder
analysis and design
Statement of responsibility
Brajesh Kumar Kaushik, Manoj Kumar Majumder
Creator
Contributor
Author
Subject
Language
eng
Summary
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and a
Member of
Cataloging source
N$T
http://library.link/vocab/creatorName
Kaushik, Brajesh Kumar
Dewey number
621.39/5
Illustrations
illustrations
Index
no index present
LC call number
TK7874.53
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
Majumder, Manoj Kumar
Series statement
SpringerBriefs in Applied Sciences and Technology,
http://library.link/vocab/subjectName
  • Interconnects (Integrated circuit technology)
  • Integrated circuits
  • Carbon nanotubes
Label
Carbon nanotube based VLSI interconnects : analysis and design, Brajesh Kumar Kaushik, Manoj Kumar Majumder, (electronic book)
Instantiates
Publication
Copyright
Antecedent source
unknown
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Preface; Contents; About the Authors; 1 Interconnects; Abstract ; 1.1 Introduction; 1.2 Types of Interconnects; 1.3 Evolution of Interconnects; 1.3.1 Aluminum Interconnects; 1.3.2 Reason Behind the Replacement of Al by Cu; 1.3.3 Demerits of Cu Interconnects; 1.3.4 Demands in Future Interconnects; 1.4 Carbon Nanotubes: The Ultimate Choice; 2 Carbon Nanotube: Properties and Applications; Abstract ; 2.1 Introduction; 2.2 Structure and Types of Carbon Nanotubes; 2.3 Electronic Band Structure of CNTs; 2.3.1 Band Structure of CNTs from Graphene
  • 2.3.2 Metallicity and Semiconducting Properties of Zigzag CNTs2.4 Properties of CNTs; 2.4.1 Electrical Conductivity; 2.4.2 Strength and Elasticity; 2.4.3 Thermal Conductivity and Expansion; 2.4.4 Field Emission; 2.4.5 Aspect Ratio; 2.4.6 Absorbent; 2.5 Production of CNTs; 2.5.1 Arc Discharge Method; 2.5.2 Laser Method; 2.5.3 Chemical Vapor Deposition; 2.5.4 Ball Milling; 2.5.5 Other Methods; 2.6 Purification of CNTs; 2.6.1 Gas Phase; 2.6.2 Liquid Phase; 2.6.3 Intercalation; 2.7 Application of CNTs; 2.7.1 Structural; 2.7.2 Electromagnetic; 2.7.3 Electroacoustic; 2.7.4 Chemical
  • 2.7.5 Mechanical2.7.6 Optical; 2.7.7 Electrical Circuits; 2.7.8 Interconnects; 2.7.9 Transistors; 3 Modeling of Carbon Nanotube Interconnects; Abstract ; 3.1 Introduction; 3.2 Analytical Models: A Technical Review; 3.2.1 Lüttinger Liquid Theory Based Model; 3.2.2 Electron Transport Theory Based Model; 3.2.3 Models Based on Physical Parameters of CNTs; 3.2.4 Diameter Dependent Modeling of CNT Interconnects; 3.2.5 Models Based on Process Induced Parameters; 3.2.6 Compact Physical Models of SWNT and MWNT Interconnects; 3.2.7 Performance Comparison of SWNT Bundles and MWNT Interconnect Models
  • 3.2.8 CNT Interconnect Models for FPGA Applications3.2.9 CNT Interconnect Models for Crosstalk Analysis; 3.2.10 Modeling of Mixed CNT Bundle Interconnects; 3.3 Geometry and Equivalent RLC Model of CNT Interconnect; 3.3.1 SWNT Interconnect; 3.3.2 DWNT Interconnect; 3.3.3 MWNT Interconnect; 3.3.4 SWNT Bundle Interconnect; 3.3.5 DWNT Bundle Interconnect; 4 Crosstalk and Delay Analysis; Abstract ; 4.1 Introduction; 4.2 Simulation Setup; 4.2.1 Motivation Behind Using CMOS Driver; 4.2.2 Simulation Setup Using Capacitively Coupled Three-Line Bus Architecture
  • 4.3 Crosstalk Induced Delay of Bundled SWNT and DWNT Interconnects4.4 Crosstalk Induced Delay of Bundled SWNT and Single MWNT Interconnects; 4.5 Crosstalk Induced Delay of Bundled SWNT, Bundled DWNT, and Single MWNT Interconnects; 5 Mixed Carbon Nanotube Bundle; Abstract ; 5.1 Introduction; 5.2 Proposed MCB Topologies; 5.3 ESC Model of MCB Interconnects; 5.4 Performance Analysis of MCB Based Interconnects; 5.4.1 Propagation Delay and Power Dissipation of MCB Topologies; 5.4.2 Crosstalk Induced Delay of MCB Topologies; References
Control code
SPR894509920
Dimensions
unknown
Extent
1 online resource (xi, 86 pages)
File format
unknown
Form of item
online
Isbn
9788132220466
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other physical details
illustrations.
Quality assurance targets
not applicable
Reformatting quality
unknown
Reproduction note
Electronic resource.
Sound
unknown sound
Specific material designation
remote
Label
Carbon nanotube based VLSI interconnects : analysis and design, Brajesh Kumar Kaushik, Manoj Kumar Majumder, (electronic book)
Publication
Copyright
Antecedent source
unknown
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Preface; Contents; About the Authors; 1 Interconnects; Abstract ; 1.1 Introduction; 1.2 Types of Interconnects; 1.3 Evolution of Interconnects; 1.3.1 Aluminum Interconnects; 1.3.2 Reason Behind the Replacement of Al by Cu; 1.3.3 Demerits of Cu Interconnects; 1.3.4 Demands in Future Interconnects; 1.4 Carbon Nanotubes: The Ultimate Choice; 2 Carbon Nanotube: Properties and Applications; Abstract ; 2.1 Introduction; 2.2 Structure and Types of Carbon Nanotubes; 2.3 Electronic Band Structure of CNTs; 2.3.1 Band Structure of CNTs from Graphene
  • 2.3.2 Metallicity and Semiconducting Properties of Zigzag CNTs2.4 Properties of CNTs; 2.4.1 Electrical Conductivity; 2.4.2 Strength and Elasticity; 2.4.3 Thermal Conductivity and Expansion; 2.4.4 Field Emission; 2.4.5 Aspect Ratio; 2.4.6 Absorbent; 2.5 Production of CNTs; 2.5.1 Arc Discharge Method; 2.5.2 Laser Method; 2.5.3 Chemical Vapor Deposition; 2.5.4 Ball Milling; 2.5.5 Other Methods; 2.6 Purification of CNTs; 2.6.1 Gas Phase; 2.6.2 Liquid Phase; 2.6.3 Intercalation; 2.7 Application of CNTs; 2.7.1 Structural; 2.7.2 Electromagnetic; 2.7.3 Electroacoustic; 2.7.4 Chemical
  • 2.7.5 Mechanical2.7.6 Optical; 2.7.7 Electrical Circuits; 2.7.8 Interconnects; 2.7.9 Transistors; 3 Modeling of Carbon Nanotube Interconnects; Abstract ; 3.1 Introduction; 3.2 Analytical Models: A Technical Review; 3.2.1 Lüttinger Liquid Theory Based Model; 3.2.2 Electron Transport Theory Based Model; 3.2.3 Models Based on Physical Parameters of CNTs; 3.2.4 Diameter Dependent Modeling of CNT Interconnects; 3.2.5 Models Based on Process Induced Parameters; 3.2.6 Compact Physical Models of SWNT and MWNT Interconnects; 3.2.7 Performance Comparison of SWNT Bundles and MWNT Interconnect Models
  • 3.2.8 CNT Interconnect Models for FPGA Applications3.2.9 CNT Interconnect Models for Crosstalk Analysis; 3.2.10 Modeling of Mixed CNT Bundle Interconnects; 3.3 Geometry and Equivalent RLC Model of CNT Interconnect; 3.3.1 SWNT Interconnect; 3.3.2 DWNT Interconnect; 3.3.3 MWNT Interconnect; 3.3.4 SWNT Bundle Interconnect; 3.3.5 DWNT Bundle Interconnect; 4 Crosstalk and Delay Analysis; Abstract ; 4.1 Introduction; 4.2 Simulation Setup; 4.2.1 Motivation Behind Using CMOS Driver; 4.2.2 Simulation Setup Using Capacitively Coupled Three-Line Bus Architecture
  • 4.3 Crosstalk Induced Delay of Bundled SWNT and DWNT Interconnects4.4 Crosstalk Induced Delay of Bundled SWNT and Single MWNT Interconnects; 4.5 Crosstalk Induced Delay of Bundled SWNT, Bundled DWNT, and Single MWNT Interconnects; 5 Mixed Carbon Nanotube Bundle; Abstract ; 5.1 Introduction; 5.2 Proposed MCB Topologies; 5.3 ESC Model of MCB Interconnects; 5.4 Performance Analysis of MCB Based Interconnects; 5.4.1 Propagation Delay and Power Dissipation of MCB Topologies; 5.4.2 Crosstalk Induced Delay of MCB Topologies; References
Control code
SPR894509920
Dimensions
unknown
Extent
1 online resource (xi, 86 pages)
File format
unknown
Form of item
online
Isbn
9788132220466
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other physical details
illustrations.
Quality assurance targets
not applicable
Reformatting quality
unknown
Reproduction note
Electronic resource.
Sound
unknown sound
Specific material designation
remote

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