Coverart for item
The Resource DTIP 2010 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010, sponsored by CMP, IEEE Components, Packaging and Manufacturing Technology Society, IEEE

DTIP 2010 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010, sponsored by CMP, IEEE Components, Packaging and Manufacturing Technology Society, IEEE

Label
DTIP 2010 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010
Title
DTIP 2010
Title remainder
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010
Statement of responsibility
sponsored by CMP, IEEE Components, Packaging and Manufacturing Technology Society, IEEE
Title variation
  • Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
  • 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP)
  • Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Creator
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
WAU
Illustrations
illustrations
Index
no index present
LC call number
TK7875
Literary form
non fiction
http://bibfra.me/vocab/lite/meetingDate
2010
http://bibfra.me/vocab/lite/meetingName
Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Components, Packaging & Manufacturing Technology Society.
  • CMP (Firm)
  • Institute of Electrical and Electronics Engineers
http://library.link/vocab/subjectName
  • Microelectromechanical systems
  • Optoelectronic devices
  • Micromachining
  • Microelectronic packaging
Label
DTIP 2010 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010, sponsored by CMP, IEEE Components, Packaging and Manufacturing Technology Society, IEEE
Instantiates
Publication
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Control code
IEEE688528621
Extent
1 online resource
Form of item
online
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other physical details
illustrations
Specific material designation
remote
System control number
  • ocn688528621
  • (OCoLC)688528621
Label
DTIP 2010 : Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Seville, Spain, 5-7 May 2010, sponsored by CMP, IEEE Components, Packaging and Manufacturing Technology Society, IEEE
Publication
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Control code
IEEE688528621
Extent
1 online resource
Form of item
online
Media category
computer
Media MARC source
rdamedia
Media type code
c
Other physical details
illustrations
Specific material designation
remote
System control number
  • ocn688528621
  • (OCoLC)688528621

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