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The Resource Field guide to optical lithography, hris A. Mack, (electronic book)

Field guide to optical lithography, hris A. Mack, (electronic book)

Label
Field guide to optical lithography
Title
Field guide to optical lithography
Statement of responsibility
hris A. Mack
Title variation
Optical lithography
Creator
Contributor
Subject
Language
eng
Summary
The material in this Field Guide is a distillation of material put together by Chris Mack over the past 20 years, including notes from his graduate-level lithography course at the University of Texas at Austin. This Field Guide details the lithography process, image formation, imaging onto a photoresist, photoresist chemistry, and lithography control and optimization. An introduction to next-generation lithographic technologies is also included, as well as an extensive lithography glossary and a summation of salient equations critical to anyone involved in the lithography industry
Member of
Additional physical form
Also available in print version.
Cataloging source
CaBNvSL
http://library.link/vocab/creatorName
Mack, Chris A.
Dewey number
621.3815/31
Illustrations
illustrations
Index
index present
LC call number
TK7874
LC item number
.M195 2006e
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
Society of Photo-optical Instrumentation Engineers
Series statement
SPIE field guides
Series volume
FG06
http://library.link/vocab/subjectName
  • Integrated circuits
  • Microlithography
Target audience
  • adult
  • specialized
Label
Field guide to optical lithography, hris A. Mack, (electronic book)
Instantiates
Publication
Note
"SPIE digital library."
Bibliography note
Includes bibliographical references and index
Color
black and white
Contents
  • Symbol glossary -- The lithography process -- Definition : semiconductor lithography -- Overview of the lithography Process -- Processing : substrate preparation -- Processing : photoresist spin coating -- Processing : post-apply bake -- Processing : alignment and exposure -- Processing : post-exposure bake -- Processing : development -- Processing : pattern transfer -- Image formation -- Maxwell's equations : the mathematics of light -- The plane wave and the phasor -- Basic imaging theory -- Diffraction -- Fraunhofer diffraction : examples -- The numerical aperture -- Fourier optics -- Spatial coherence and oblique illumination -- Partial coherence -- Aberrations -- Aberrations : the Zernike polynomial -- Aberrations : Zernike examples -- Chromatic aberration -- Horizontal-vertical (H-V) bias -- Defocus -- Flare -- Vector nature of light -- Polarization -- The optical invariant -- Immersion lithography : resolution -- Immersion lithography : depth of focus -- Imaging into a photoresist -- Standing waves: definition -- Standing waves: mathematics -- Fresnel reflectivity -- Swing curves -- Top antireflective coatings (TARC) -- Bottom antireflective coatings (BARC) -- Photoresist chemistry -- Novolak/DNQ resists -- Chemically amplified resists -- Absorption of light -- Photoresist bleaching and the Dill parameters -- Exposure kinetics -- Measuring the Dill ABC parameters -- Chemically amplified resist kinetics
  • Diffusion in chemically amplified resists -- Acid loss mechanisms -- Post-apply bake effects -- Photoresist development kinetics -- Surface inhibition -- Developer temperature and concentration -- The development path -- Lithography control and optimization -- NILS : the normalized image log-slope -- NILS : the log-slope defocus curve -- NILS : image optimization -- NILS : exposure optimization -- NILS : PEB optimization -- NILS : development optimization -- NILS : total Process optimization -- Defining photoresist linewidth -- Critical dimension control -- Critical dimension control : effect on devices -- Overlay control -- Line edge roughness -- Metrology : critical dimension -- Metrology : overlay -- The process window -- Depth of focus -- Resolution -- Rayleigh criteria : resolution -- Rayleigh criteria : depth of focus -- Mask error enhancement factor (MEEF) -- Resolution enhancement technologies -- Phase-shift masks -- Phase-shift masks : alternating -- Phase-shift masks : attenuated -- Optical proximity effects -- Optical proximity correction (OPC) -- Off-axis illumination -- Lithography simulation -- Moore's law -- Next-generation lithography (NGL) -- Equation summary -- Glossary -- Index
Dimensions
unknown
Extent
1 online resource (xii, 122 p. : ill.)
File format
multiple file formats
Form of item
electronic
Isbn
9780819462077
Other physical details
digital file.
Reformatting quality
access
Reproduction note
Electronic resource.
Specific material designation
remote
System details
System requirements: Adobe Acrobat Reader
Label
Field guide to optical lithography, hris A. Mack, (electronic book)
Publication
Note
"SPIE digital library."
Bibliography note
Includes bibliographical references and index
Color
black and white
Contents
  • Symbol glossary -- The lithography process -- Definition : semiconductor lithography -- Overview of the lithography Process -- Processing : substrate preparation -- Processing : photoresist spin coating -- Processing : post-apply bake -- Processing : alignment and exposure -- Processing : post-exposure bake -- Processing : development -- Processing : pattern transfer -- Image formation -- Maxwell's equations : the mathematics of light -- The plane wave and the phasor -- Basic imaging theory -- Diffraction -- Fraunhofer diffraction : examples -- The numerical aperture -- Fourier optics -- Spatial coherence and oblique illumination -- Partial coherence -- Aberrations -- Aberrations : the Zernike polynomial -- Aberrations : Zernike examples -- Chromatic aberration -- Horizontal-vertical (H-V) bias -- Defocus -- Flare -- Vector nature of light -- Polarization -- The optical invariant -- Immersion lithography : resolution -- Immersion lithography : depth of focus -- Imaging into a photoresist -- Standing waves: definition -- Standing waves: mathematics -- Fresnel reflectivity -- Swing curves -- Top antireflective coatings (TARC) -- Bottom antireflective coatings (BARC) -- Photoresist chemistry -- Novolak/DNQ resists -- Chemically amplified resists -- Absorption of light -- Photoresist bleaching and the Dill parameters -- Exposure kinetics -- Measuring the Dill ABC parameters -- Chemically amplified resist kinetics
  • Diffusion in chemically amplified resists -- Acid loss mechanisms -- Post-apply bake effects -- Photoresist development kinetics -- Surface inhibition -- Developer temperature and concentration -- The development path -- Lithography control and optimization -- NILS : the normalized image log-slope -- NILS : the log-slope defocus curve -- NILS : image optimization -- NILS : exposure optimization -- NILS : PEB optimization -- NILS : development optimization -- NILS : total Process optimization -- Defining photoresist linewidth -- Critical dimension control -- Critical dimension control : effect on devices -- Overlay control -- Line edge roughness -- Metrology : critical dimension -- Metrology : overlay -- The process window -- Depth of focus -- Resolution -- Rayleigh criteria : resolution -- Rayleigh criteria : depth of focus -- Mask error enhancement factor (MEEF) -- Resolution enhancement technologies -- Phase-shift masks -- Phase-shift masks : alternating -- Phase-shift masks : attenuated -- Optical proximity effects -- Optical proximity correction (OPC) -- Off-axis illumination -- Lithography simulation -- Moore's law -- Next-generation lithography (NGL) -- Equation summary -- Glossary -- Index
Dimensions
unknown
Extent
1 online resource (xii, 122 p. : ill.)
File format
multiple file formats
Form of item
electronic
Isbn
9780819462077
Other physical details
digital file.
Reformatting quality
access
Reproduction note
Electronic resource.
Specific material designation
remote
System details
System requirements: Adobe Acrobat Reader

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