Coverart for item
The Resource ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA, organized by Electronic Device Failure Analysis Society, ASM International, (electronic book)

ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA, organized by Electronic Device Failure Analysis Society, ASM International, (electronic book)

Label
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
Title
ISTFA 2014
Title remainder
conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
Statement of responsibility
organized by Electronic Device Failure Analysis Society, ASM International
Creator
Contributor
Organizer
Subject
Genre
Language
eng
Member of
Cataloging source
E7B
Dewey number
621.381
Illustrations
  • illustrations
  • photographs
Index
index present
LC call number
TK7871
LC item number
.I884 2014eb
Literary form
non fiction
http://bibfra.me/vocab/lite/meetingDate
2014
http://bibfra.me/vocab/lite/meetingName
International Symposium for Testing and Failure Analysis
Nature of contents
dictionaries
http://library.link/vocab/relatedWorkOrContributorName
  • Electronic Device Failure Analysis Society
  • ASM International
http://library.link/vocab/subjectName
  • Electronics
  • Electronic apparatus and appliances
Label
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA, organized by Electronic Device Failure Analysis Society, ASM International, (electronic book)
Instantiates
Publication
Copyright
Note
Includes index
Carrier category
online resource
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type MARC source
rdacontent
Contents
  • ""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee -- 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110""
  • ""Cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage â€? Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages""
  • ""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM -- A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips""
  • ""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines""
  • ""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ â€?lift-outâ€? TEM Sample Preparation with FIB for 14nm FinFET""
Control code
KNOVEL900889018
Dimensions
unknown
Extent
1 online resource (560 pages)
Form of item
online
Isbn
9781627080750
Media category
computer
Media MARC source
rdamedia
Other physical details
color illustrations, photographs.
Specific material designation
remote
Label
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA, organized by Electronic Device Failure Analysis Society, ASM International, (electronic book)
Publication
Copyright
Note
Includes index
Carrier category
online resource
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type MARC source
rdacontent
Contents
  • ""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee -- 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110""
  • ""Cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage â€? Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages""
  • ""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM -- A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips""
  • ""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines""
  • ""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ â€?lift-outâ€? TEM Sample Preparation with FIB for 14nm FinFET""
Control code
KNOVEL900889018
Dimensions
unknown
Extent
1 online resource (560 pages)
Form of item
online
Isbn
9781627080750
Media category
computer
Media MARC source
rdamedia
Other physical details
color illustrations, photographs.
Specific material designation
remote

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