Coverart for item
The Resource Lithography process control, Harry J. Levinson, (electronic book)

Lithography process control, Harry J. Levinson, (electronic book)

Label
Lithography process control
Title
Lithography process control
Statement of responsibility
Harry J. Levinson
Creator
Subject
Language
eng
Summary
This text covers lithography process control at several levels, from fundamental through advanced topics. The book is a self-contained tutorial that works both as an introduction to the technology and as a reference for the experienced lithographer. It reviews the foundations of statistical process control as background for advanced topics such as complex processes and feedback. In addition, it presents control methodologies that may be applied to process development pilot lines
Member of
Cataloging source
KNOVL
http://library.link/vocab/creatorName
Levinson, Harry J.
Dewey number
621.3815/2
Illustrations
illustrations
Index
index present
LC call number
TK7871.85
LC item number
.L464 1999eb
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Series statement
Tutorial texts in optical engineering
Series volume
28
http://library.link/vocab/subjectName
  • Semiconductors
  • Microlithography
  • Microlithographie
  • Commande de processus
  • Semiconducteurs
  • Lithographie (Halbleitertechnologie)
  • Statistische Prozesslenkung
Label
Lithography process control, Harry J. Levinson, (electronic book)
Instantiates
Publication
Bibliography note
Includes bibliographical references (p. 169-188) and index
Color
multicolored
Contents
  • ch. 5.
  • Overlay
  • ch. 6.
  • Yield
  • ch. 7.
  • Process drift and automatic process control
  • ch. 8.
  • Metrology
  • ch. 9.
  • Control of operations
  • ch. 1.
  • Introduction to the use of statistical process control in lithography
  • ch. 2.
  • Sampling
  • ch. 3.
  • Simple and complex processes
  • ch. 4.
  • Linewidth control
  • 1. Introduction to the use of statistical process control in lithography -- The assumptions underlying statistical process control -- The properties of statistical process control -- Situations in lithography where statistical process control cannot be applied naively -- Non-normal distributions -- Process capability -- 2. Sampling -- Choosing the proper sample size -- Measurement location considerations -- Correlations -- Measurement frequency -- Systematic sources of variation -- 3. Simple and complex processes -- Definitions -- Why test wafers are useful -- How to address complex processes in lithography -- Distinguishing between layer-specific and equipment-specific effects -- 4. Linewidth control -- Cause and effect -- Independent variables -- Exposure dose -- Resist thickness -- Focus -- Bake temperatures -- Resist development -- Humidity -- DUV resists--special considerations -- Contributions from reticles -- Maximizing the process window -- 5. Overlay -- Overlay models -- Matching -- Contributions from processing and alignment mark optimization -- Addressing the problem of non-normal distributions -- Outliers -- 6. Yield -- Yield monitor strategy -- Yield models -- Parameters which affect yield -- 7. Process drift and automatic process control -- Adjusting for process drift -- The exponentially-weighted moving average -- Automatic process control -- 8. Metrology -- The need for understanding the measurement process: defect detection -- Linewidth measurement using scanning electron microscopes -- Electrical linewidth measurement -- Measurement error budgets -- Measurement of overlay -- 9. Control of operations -- Self-control -- Documentation -- ISO 9000
Dimensions
26 cm.
Dimensions
unknown
Extent
x, 190 p.
Form of item
electronic
Isbn
9781615837366
Other physical details
ill.
Reproduction note
Electronic resource.
Specific material designation
remote
Label
Lithography process control, Harry J. Levinson, (electronic book)
Publication
Bibliography note
Includes bibliographical references (p. 169-188) and index
Color
multicolored
Contents
  • ch. 5.
  • Overlay
  • ch. 6.
  • Yield
  • ch. 7.
  • Process drift and automatic process control
  • ch. 8.
  • Metrology
  • ch. 9.
  • Control of operations
  • ch. 1.
  • Introduction to the use of statistical process control in lithography
  • ch. 2.
  • Sampling
  • ch. 3.
  • Simple and complex processes
  • ch. 4.
  • Linewidth control
  • 1. Introduction to the use of statistical process control in lithography -- The assumptions underlying statistical process control -- The properties of statistical process control -- Situations in lithography where statistical process control cannot be applied naively -- Non-normal distributions -- Process capability -- 2. Sampling -- Choosing the proper sample size -- Measurement location considerations -- Correlations -- Measurement frequency -- Systematic sources of variation -- 3. Simple and complex processes -- Definitions -- Why test wafers are useful -- How to address complex processes in lithography -- Distinguishing between layer-specific and equipment-specific effects -- 4. Linewidth control -- Cause and effect -- Independent variables -- Exposure dose -- Resist thickness -- Focus -- Bake temperatures -- Resist development -- Humidity -- DUV resists--special considerations -- Contributions from reticles -- Maximizing the process window -- 5. Overlay -- Overlay models -- Matching -- Contributions from processing and alignment mark optimization -- Addressing the problem of non-normal distributions -- Outliers -- 6. Yield -- Yield monitor strategy -- Yield models -- Parameters which affect yield -- 7. Process drift and automatic process control -- Adjusting for process drift -- The exponentially-weighted moving average -- Automatic process control -- 8. Metrology -- The need for understanding the measurement process: defect detection -- Linewidth measurement using scanning electron microscopes -- Electrical linewidth measurement -- Measurement error budgets -- Measurement of overlay -- 9. Control of operations -- Self-control -- Documentation -- ISO 9000
Dimensions
26 cm.
Dimensions
unknown
Extent
x, 190 p.
Form of item
electronic
Isbn
9781615837366
Other physical details
ill.
Reproduction note
Electronic resource.
Specific material designation
remote

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