Coverart for item
The Resource More-than-Moore 2.5D and 3D SiP integration, Riko Radojcic, (electronic resource)

More-than-Moore 2.5D and 3D SiP integration, Riko Radojcic, (electronic resource)

Label
More-than-Moore 2.5D and 3D SiP integration
Title
More-than-Moore 2.5D and 3D SiP integration
Statement of responsibility
Riko Radojcic
Creator
Subject
Language
eng
Summary
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore?s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore?s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
Member of
Cataloging source
EBLCP
http://library.link/vocab/creatorName
Radojcic, Riko
Dewey number
  • 006.2/2
  • 620
Index
index present
LC call number
  • TK7895.E42
  • TA1-2040
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/subjectName
  • Embedded computer systems
  • Systems integration
Label
More-than-Moore 2.5D and 3D SiP integration, Riko Radojcic, (electronic resource)
Instantiates
Publication
Note
5.4.3 Concluding Remarks
Antecedent source
file reproduced from an electronic resource
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Preface; Acknowledgements; Contents; Definition of Acronyms; Definition of Terms; 1 Introduction; References; 2 More-than-Moore Technology Opportunities: 2.5D SiP; 2.1 Overview; 2.2 2.5D SiP Technology Candidates; 2.2.1 Through-Si Interposer (TSI); 2.2.2 Low-Cost Si Interposer (LCIs); 2.2.3 Photo-Defined Organic Interposer (POI); 2.2.4 Low-Cost Glass Interposer (LCIg); 2.2.5 Fan Out WLP; 2.2.6 Hybrid Technologies (SLIT, SLIM); 2.3 2.5D SiP Technology Value Propositions; 2.3.1 System Integration Value Proposition; 2.3.2 Split Die SiP Value Proposition; 2.3.3 Small Die SiP Value Propositions
  • 2.4 2.5D SiP Technology Tradeoffs2.4.1 Architecture Knobs; 2.4.2 Physical Design Knobs; 2.4.3 Si Technology Knobs; 2.4.4 Packaging Technology Knobs; 2.4.5 Test Knobs; 2.5 2.5D SiP Technology Solutions; 2.5.1 2.5D Technology Solutions for Integrated SiP; 2.5.2 2.5D Technology Solutions for Area-Based Split Die SiP; 2.5.3 2.5D Technology Solutions for Small Die SiP; References; 3 More-than-Moore Technology Opportunities: 3D SiP; 3.1 Overview; 3.2 3D SiP Technology Options; 3.2.1 Requirements; 3.2.2 TSV Formation; 3.2.3 TSV Integration with CMOS Flow; 3.2.4 TSV Integration with Assembly Flow
  • 3.3 3D SiP Technology Value Propositions3.3.1 Homogenous 3D SiP Integration Value Proposition; 3.3.2 Heterogeneous 3D SiP Integration Value; 3.3.3 WideIO Memory Value Proposition; 3.4 3D SiP Technology Tradeoffs; 3.4.1 Architecture Knobs; 3.4.2 Application Knobs; 3.4.3 Physical Design Knobs; 3.4.4 TSV Technology Knobs; 3.5 3D SiP Technology Solutions; 3.5.1 3D Technology Solutions for Heterogeneous M-o-L Integration; 3.5.2 3D Technology Solutions for Homogeneous and/or Heterogenous L-o-L Integration; References; 4 More-than-Moore Design Eco-System; 4.1 Overview
  • 4.2 More-than-Moore Architectural Opportunities4.2.1 Architecture Concepts; 4.2.2 Physical Partitioning Concepts; 4.3 More-than-Moore Design for Multi-Physics Opportunities; 4.3.1 Challenges; 4.3.2 Infrastructure Requirements; 4.3.3 Thermal Management; 4.3.4 Mechanical Stress Management; 4.3.5 Electrical Interaction Management; 4.4 More-than-Moore Design Methodology Opportunities; 4.4.1 Design Methodology Requirements-Ideal; 4.4.2 Design Methodology Requirements-Practical; 4.4.3 Design Methodology-Current Status; 4.5 More-than-Moore Modeling and Characterization Opportunities
  • 4.5.1 Test Chip Strategy4.5.2 Test Chip Content; 4.5.3 Characterization and Models; References; 5 More-than-Moore Adoption Landscape; 5.1 Business Development Landscape; 5.1.1 "The Cast"; 5.1.2 "The Plot"; 5.2 Technology Development Landscape; 5.2.1 Landscape for "More-Moore" Scaling; 5.2.2 Landscape for "More-than-Moore" Scaling; 5.3 Product Development Landscape; 5.3.1 Technology Intersect; 5.3.2 Schedule Conundrum; 5.3.3 Cost Projection Conundrum; 5.3.4 Risk Conundrum; 5.3.5 Benefit Conundrum; 5.4 Observations and Opinions; 5.4.1 Product Sector Drivers; 5.4.2 Mobile Sector Drivers
Dimensions
unknown
Extent
1 online resource (192 p.)
File format
one file format
Form of item
online
Isbn
9783319525471
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
c
Quality assurance targets
unknown
Reformatting quality
unknown
Specific material designation
remote
System control number
ocn972292552
Label
More-than-Moore 2.5D and 3D SiP integration, Riko Radojcic, (electronic resource)
Publication
Note
5.4.3 Concluding Remarks
Antecedent source
file reproduced from an electronic resource
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Preface; Acknowledgements; Contents; Definition of Acronyms; Definition of Terms; 1 Introduction; References; 2 More-than-Moore Technology Opportunities: 2.5D SiP; 2.1 Overview; 2.2 2.5D SiP Technology Candidates; 2.2.1 Through-Si Interposer (TSI); 2.2.2 Low-Cost Si Interposer (LCIs); 2.2.3 Photo-Defined Organic Interposer (POI); 2.2.4 Low-Cost Glass Interposer (LCIg); 2.2.5 Fan Out WLP; 2.2.6 Hybrid Technologies (SLIT, SLIM); 2.3 2.5D SiP Technology Value Propositions; 2.3.1 System Integration Value Proposition; 2.3.2 Split Die SiP Value Proposition; 2.3.3 Small Die SiP Value Propositions
  • 2.4 2.5D SiP Technology Tradeoffs2.4.1 Architecture Knobs; 2.4.2 Physical Design Knobs; 2.4.3 Si Technology Knobs; 2.4.4 Packaging Technology Knobs; 2.4.5 Test Knobs; 2.5 2.5D SiP Technology Solutions; 2.5.1 2.5D Technology Solutions for Integrated SiP; 2.5.2 2.5D Technology Solutions for Area-Based Split Die SiP; 2.5.3 2.5D Technology Solutions for Small Die SiP; References; 3 More-than-Moore Technology Opportunities: 3D SiP; 3.1 Overview; 3.2 3D SiP Technology Options; 3.2.1 Requirements; 3.2.2 TSV Formation; 3.2.3 TSV Integration with CMOS Flow; 3.2.4 TSV Integration with Assembly Flow
  • 3.3 3D SiP Technology Value Propositions3.3.1 Homogenous 3D SiP Integration Value Proposition; 3.3.2 Heterogeneous 3D SiP Integration Value; 3.3.3 WideIO Memory Value Proposition; 3.4 3D SiP Technology Tradeoffs; 3.4.1 Architecture Knobs; 3.4.2 Application Knobs; 3.4.3 Physical Design Knobs; 3.4.4 TSV Technology Knobs; 3.5 3D SiP Technology Solutions; 3.5.1 3D Technology Solutions for Heterogeneous M-o-L Integration; 3.5.2 3D Technology Solutions for Homogeneous and/or Heterogenous L-o-L Integration; References; 4 More-than-Moore Design Eco-System; 4.1 Overview
  • 4.2 More-than-Moore Architectural Opportunities4.2.1 Architecture Concepts; 4.2.2 Physical Partitioning Concepts; 4.3 More-than-Moore Design for Multi-Physics Opportunities; 4.3.1 Challenges; 4.3.2 Infrastructure Requirements; 4.3.3 Thermal Management; 4.3.4 Mechanical Stress Management; 4.3.5 Electrical Interaction Management; 4.4 More-than-Moore Design Methodology Opportunities; 4.4.1 Design Methodology Requirements-Ideal; 4.4.2 Design Methodology Requirements-Practical; 4.4.3 Design Methodology-Current Status; 4.5 More-than-Moore Modeling and Characterization Opportunities
  • 4.5.1 Test Chip Strategy4.5.2 Test Chip Content; 4.5.3 Characterization and Models; References; 5 More-than-Moore Adoption Landscape; 5.1 Business Development Landscape; 5.1.1 "The Cast"; 5.1.2 "The Plot"; 5.2 Technology Development Landscape; 5.2.1 Landscape for "More-Moore" Scaling; 5.2.2 Landscape for "More-than-Moore" Scaling; 5.3 Product Development Landscape; 5.3.1 Technology Intersect; 5.3.2 Schedule Conundrum; 5.3.3 Cost Projection Conundrum; 5.3.4 Risk Conundrum; 5.3.5 Benefit Conundrum; 5.4 Observations and Opinions; 5.4.1 Product Sector Drivers; 5.4.2 Mobile Sector Drivers
Dimensions
unknown
Extent
1 online resource (192 p.)
File format
one file format
Form of item
online
Isbn
9783319525471
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
c
Quality assurance targets
unknown
Reformatting quality
unknown
Specific material designation
remote
System control number
ocn972292552

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