The Resource Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering, (electronic book)

Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering, (electronic book)

Label
Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA
Title
Photonics packaging and integration IV
Title remainder
29 January 2003, San Jose, California, USA
Statement of responsibility
Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering
Title variation
  • Photonics packaging and integration 4
  • Photonics packaging and integration four
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
NHM
http://bibfra.me/vocab/lite/collectionName
Optoelectronic interconnects
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Heyler, Randy A
  • Chen, Ray T
  • Society of Photo-optical Instrumentation Engineers
  • SPIE Digital Library
Series statement
SPIE proceedings series,
Series volume
5358
http://library.link/vocab/subjectName
  • Optoelectronic devices
  • Optical interconnects
  • Microelectronic packaging
  • Photonics
Label
Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering, (electronic book)
Instantiates
Publication
Note
Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Bibliography note
Includes bibliographical references and index
Color
multicolored
Dimensions
28 cm.
Dimensions
unknown
Extent
vii, 168 p.
Form of item
electronic
Other physical details
ill.
Reproduction note
Electronic resource.
Specific material designation
remote
Label
Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering, (electronic book)
Publication
Note
Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Bibliography note
Includes bibliographical references and index
Color
multicolored
Dimensions
28 cm.
Dimensions
unknown
Extent
vii, 168 p.
Form of item
electronic
Other physical details
ill.
Reproduction note
Electronic resource.
Specific material designation
remote

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