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The Resource Plasma etching processes for interconnect realization in VLSI, edited by Nicolas Posseme, (electronic book)

Plasma etching processes for interconnect realization in VLSI, edited by Nicolas Posseme, (electronic book)

Label
Plasma etching processes for interconnect realization in VLSI
Title
Plasma etching processes for interconnect realization in VLSI
Statement of responsibility
edited by Nicolas Posseme
Contributor
Editor
Subject
Language
eng
Summary
This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions
Cataloging source
N$T
Dewey number
621.3815
Index
index present
LC call number
TK7874.75
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
Posseme, Nicolas
http://library.link/vocab/subjectName
  • Integrated circuits
  • Plasma etching
  • Molded interconnect devices
  • Integrated circuits
  • Integrated circuits
  • Integrated circuits
Label
Plasma etching processes for interconnect realization in VLSI, edited by Nicolas Posseme, (electronic book)
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
  • Front Cover ; Plasma Etching Processes for Interconnect Realization in VLSI; Copyright ; Contents ; List of Acronyms ; Preface ; Chapter 1: Introduction ; 1.1. Integration Processes Related to Copper Introduction ; 1.2. Dielectric Material with Low-k Value (<4) ; Chapter 2: Interaction Plasma/Dielectric; 2.1. Porous SiOCH Film Etching; 2.2. Porous SiOCH Film Sensitivity to Post-Etch Treatments ; Chapter 3: Porous SiOCH Film Integration; 3.1. Trench First Metallic Hard Mask Integration ; 3.2. Porous SiOCH Integration Using the Via First Approach ; 3.3. Summary
  • Chapter 4: Interconnects for Tomorrow 4.1. Consequence of Porosity Increase ; 4.2. Process Solutions for Dielectric Constant Reduction ; 4.3. Material Solutions for Dielectric Constant Reduction ; 4.4. Alternative Interconnect Architectures for Dielectric Constant Reduction ; 4.5. Conclusion ; Bibliography ; List of Authors ; Index
Control code
SCIDI907467284
Dimensions
unknown
Extent
1 online resource
File format
unknown
Form of item
online
Isbn
9780081005903
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Reformatting quality
preservation
Sound
unknown sound
Specific material designation
remote
Label
Plasma etching processes for interconnect realization in VLSI, edited by Nicolas Posseme, (electronic book)
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
  • Front Cover ; Plasma Etching Processes for Interconnect Realization in VLSI; Copyright ; Contents ; List of Acronyms ; Preface ; Chapter 1: Introduction ; 1.1. Integration Processes Related to Copper Introduction ; 1.2. Dielectric Material with Low-k Value (<4) ; Chapter 2: Interaction Plasma/Dielectric; 2.1. Porous SiOCH Film Etching; 2.2. Porous SiOCH Film Sensitivity to Post-Etch Treatments ; Chapter 3: Porous SiOCH Film Integration; 3.1. Trench First Metallic Hard Mask Integration ; 3.2. Porous SiOCH Integration Using the Via First Approach ; 3.3. Summary
  • Chapter 4: Interconnects for Tomorrow 4.1. Consequence of Porosity Increase ; 4.2. Process Solutions for Dielectric Constant Reduction ; 4.3. Material Solutions for Dielectric Constant Reduction ; 4.4. Alternative Interconnect Architectures for Dielectric Constant Reduction ; 4.5. Conclusion ; Bibliography ; List of Authors ; Index
Control code
SCIDI907467284
Dimensions
unknown
Extent
1 online resource
File format
unknown
Form of item
online
Isbn
9780081005903
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Reformatting quality
preservation
Sound
unknown sound
Specific material designation
remote

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