The technology of wafers and waffles, I, Operational aspects

Resource Information

The work The technology of wafers and waffles, I, Operational aspects represents a distinct intellectual or artistic creation found in Sydney Jones Library, University of Liverpool. This resource is a combination of several types including: Work, Language Material, Books.

Label

The technology of wafers and waffles, I, Operational aspects

Title number

I

Title part

Operational aspects

Statement of responsibility

Karl F. Tiefenbacher

Creator

• Tiefenbacher, Karl F

Author

• Tiefenbacher, Karl F

Subject

• Baked products industry
• Baked products industry
• Pancakes, waffles, etc
• Pancakes, waffles, etc
• Baked products
• Baked products

Language

eng

Summary

The Technology of Wafers and Waffles: Operational AspectsïŽis the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing. The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles

Cataloging source

N$T

Dewey number

• 641.81/53
• 664.7525

Index

index present

LC call number

TX770.P34

Literary form

non fiction

Nature of contents

• dictionaries
• bibliography